1. Complete SMT files (Gerber files, bit number maps, coordinate files, steel mesh files) and special requirements for SMT processing;
2. Complete BOM files(including model, bit number, package, description, usage, etc.);
PS: The functional test fee is required, and the functional test method is required.
There are 4 SMT patch production lines, equipped with Japanese YAMAHA automatic patch line, automatic solder paste printing machine, eight temperature zone and ten temperature zone reflow oven, AOI, first piece machine and other high-end equipment, and the chip production capacity is 6 million welding. Point/day, the maximum production capacity of the wave soldering processing day is 500,000 points. With mounting 01005 and 0.40MM pitch BGA placement capability and computer motherboard wave soldering capabilities.
|SMT capacity||6 million solder joints / day|
|SMT production line||4 patch lines, 1 wave soldering|
|Throwing rate||0.3% of resistance class (0201, 0402: 0.5%, excluding large parts)|
|IC class: no throwing|
|Board type||ordinary circuit board, FPC board, rigid-flex board|
|SMD Component Spec.||Min component||01005 Chip/0.4 Pitch BGA|
|Min component accuracy||±0.04mm|
|Precision of IC type patch||±0.03mm|
|Patch PCB Spec.||PCB Size||50*50mm - 774*710mm|